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    1. 无卤PI覆铜箔基材 Halogen-Free Polyimide Film Based FCCL

      产品特点:
      优异的耐高温高湿性能
      良好的尺寸安定性、挠曲性及耐离子迁移
      优良的电性能,化学性能及耐热性能
      不含卤素, 阻燃性能达到UL94 VTM-0
      本产品符合IPC规范

      Feature:
      Excellent high humidity and temperature resistance
      Excellent dimensional stability,High flexibility and
      Excellent Migration ability
      Excellent electrical ,chemical and thermal property
      Halogen free and Flame retardancy UL 94VTM-0
      Meet with IPC standards

      产品特性(FCCL Characteristic):
      特性
      property
      单位
      Unit
      条件
      Condition
      标准
      Standard
      AFED131218 AFED131212 测试方法
      Test method
      Copper Foil
      Adhesive
      PI Film
      Adhesive
      Copper Foil
      Peel Strength Kgf/cm
      (90?)
      normal H mil≧0.8
      1 mil≧1.0
      1.3~1.5 1.1~1.3 IPC-TM-650 2.4.9
      Dimension Stability TD % Method B ≦±0.15 0.05~0.10 0.40~0.08 IPC-TM-650 2.2.4
      MD % -0.05~0.06 -0.07~0.03
      Solder Float Resistance --- 300℃/10sec No Change Appearance Pass Pass IPC-TM-650 2.4.13
      Chemical Resistance % NaOH ≦20 1~7 1~7 IPC-TM-650 2.3.2
      % HCI 1~8 1~8
      % IPA 1~7 1~7
      Moisture Absorption % D-24/23 ≦2.0 0.9~1.3 1.0~1.4 IPC-TM-650 2.6.2
      Volume Resistance Ω-cm C-96/23/65 ≧1012 ≧1014 ≧1014 IPC-TM-650 2.5.17
      Surface Resistance Ω C-96/23/65 ≧1010 ≧1012 ≧1012
      Insulation resistance Ω C-96/23/65 ≧109 ≧109 ≧109 IPC-TM-650 2.6.3.2
      Dielectric constant 10MHZ --- C-48/40/90 ≦4.0 3.4~3.6 IPC-TM-650 2.5.5.3
      Dissipation factor 10MHZ --- C-48/40/90 ≦0.04 0.032~0.036
      Note:1. Data shown above are nominal values for reference only,Details see Certification of Quality
        2. Storage Condition:Vacuum Packaging: Below 30℃ for 1year,
      Normal Packaging : Below 30℃,below 70% RH for 1year
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